Server: Netscape-Communications/1.1b1 Date: Friday, 21-Nov-97 05:03:31 GMT Last-modified: Thursday, 14-Aug-97 19:03:48 GMT Content-length: 6984 Content-type: text/html PACKAGING CAPABILITIES
PACKAGING CAPABILITIES
 

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MCM MULTICHIP MODULES  

Multichip modules from HEI can reduce board space for electronic circuits that contain several integrated circuits with high I/O counts. These high density modules can be manufactured on both ceramic and laminate substrates with up to 80% silicon coverage.

 
  • Thick film printing 006/.006 
  • Diffusion patterning. 004/.004 
  • Fodel imaging .002/.002 
  • Multilayer laminate and ceramic
  • Die bond pitch to .006 
  • Blind vias and thru vias to .002

  • CHIP-ON-LAMINATE   

    Chip on laminate in most cases is the lowest cost packaging solution for circuit size reduction. Most circuitry requiring less than 3 conductive layers with minimal power dissipation requirements are ideal applications for this technology. HEI can integrate chip & wire, flip chip, and surface mount devices, or combination of these technologies to offer the best final circuit price and performance.

  • Chip & wire interconnects
  • Flip chip IC integration 
  • Multilayer laminate designs 
  • Aluminum, gold and palladium bonding
  • Leading edge SMT to die design layout 

  • CHIP-ON-FLEX   

    Direct chip attach and interconnect on flex circuitry can offer reduced size as well as flexible interconnection capability. HEI can manufacture active flex circuitry using both chip & wire, and flip chip technology. Chip-on-flex can offer the most adaptable finished product assembly. 

  • Chip & wire interconnect
  • Flip chip on flex IC integration
  • Passive component attachment
  • Flex design/CAD support
  • X-ray inspection capability

  • BGA/CSP/FLIP CHIP  

    HEI Flip Chip/BGA/CSP technology can accommodate either single chip or multiple chip integration on both ceramic and laminate substrates. These high density packages offer the smallest circuit outline with finished sizes only slightly larger than the circuit IC's. 

  • Flip chip and chip & wire interconnects
  • Ceramic or laminate substrates
  • Single and multiple IC packages
  • .006 - .008 die bump pitches
  • Outlines as small as .008 larger than IC
  • Full test and X-ray inspection capabilities

  • CHIP STACKING    

    HEI specializes in multilevel interconnection of semiconductors. "Chip stacking" can be achieved by mounting wire bonded IC's over flip chip circuits, mounting IC's on top of other wire bonded IC's or mounting IC's over passive components. Vertical stacking of both active and passive components can minimize the finished circuit outline. 

  • Multilevel IC interconnects
  • Chip stacking
  • Aluminum, gold, and palladium bonding
  • Flip chip and wire bond combinations
  • Creative package design

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