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Date: Thu, 20 Nov 1997 20:16:26 GMT
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Litton: Inter-Pak Electronics Capabilities
Process Capabilities
Reviewed October, 1996 by Linda L. Self
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PANEL SIZE
- 42" length in production for press fit and hybrid SMT. Standard SMT up to 24" X 24".
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PRESS FIT
- Automated processes for the controlled, consistent placement and insertion of all press fit connector systems and devices, including high density, rivets, polarizing keys, and power lugs.
Capable of inserting up to 1,000 pin connectors automatically.
Custom "gang" tooling for insertion of multiple types of connectors for increased efficiencies.
Blockloader automatically loads multiple contact types.
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SOLDER TECHNOLOGY
- Inter-Pak has more experience in successfully soldering high layer count, complex design, and/or large backplanes with high reliability than any other backpanel manufacturer.
ESD controls, training and annual certification.
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Selective Soldering System
- Computer-controlled, high precision light beam soldering system for ultra-high performance connectors with pitches of .025" and .050" over a span of 5.8".
Integrated, computer controlled, vacuum solder system with preheater, flux and automated solder fountain for thick backpanels with heat sinking outerlayers and/or signal layers close to the surface.
Direct power system operates at lower temperatures for thick multilayers with heavy ground planes.
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Hand Soldering System
- Up to 24" wide, placement speed of 2500-3800 components per hour by stencil or dispenser using water soluble, no clean flux.
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Ultrafine pitch SMT backpanels
- Solder paste application
- Installs resistors, capacitors, resistor networks, IC networks, LED's, PALS, clocks/clock drivers, E-PROMS and EE-PROMS.
- High Speed Placement Machine
- Places wide range of component sizes and shapes as close together as 0.0049".
- Forced Convection Reflow System
- Nitrogen capable, with 7 regions, or 14 zones, individually controlled for accurate temperature profiling.
- Oven
- Computer controlled with custom cycle profiling.
- Cleaning and Drying
- Final rinse DI water.
SIR and SEC Bellcore cleanliness compliance.
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TESTING
- Level 1,2,3, and 4.
Programming for PALs, E-PROMS, and EE-PROMS.
Supports all logic families and device package materials, SMT, through hole, TAB and PGA packages.
Impedance: Single-ended (characteristic), Differential, and Broadside.
Correlation to pcb and original design.
IR (Insulation Resistance) Drop.
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QUALITY SYSTEM
- Registered to ISO 9002, Certificate No. 95021 (February 3, 1995 - February 3, 1998).
For equipment details, refer to Inter-Pak's Electronics' Key Equipment List.